Assemble your electronic board with EMSFACTORY

From the simplest to the most complex, quote and assemble your electronic board project thanks to EMSFACTORY the connected factory.

Online demoStart a project

Manage the production of your projects online

Configure your project online

EMSFACTORY web platform. Online quotation. Library.

Validate your quantities and deadlines with the Price Optimizer

Connected to the largest suppliers. The best price in a few minutes.

Launch and follow the manufacturing process from your web account

Order online in one click. Follow the progress step by step in the factory.

Receive your order in Express

Track your delivery thanks to the tracking of your package anywhere in the world.

Our key advantages

Online quotation

Get a detailed price for your project in a few minutes based on the time and quantity you choose.

Component library

Access our library of standard components and take advantage of our negotiated prices.

No tooling costs

EMSFACTORY's technologies eliminate all production tooling.

Price transparency

Visualise the price of each part and assembly, control your production costs.

Real-time tracking

Follow the manufacturing process online from your web account, receive notifications by email or SMS.

Create your project online

PCB specification
Simply define your standard or complex PCB, dimensions, 1 to 48 layers...
Import BOM
Import your file, the EMSFACTORY algorithm will find the available components at the best price.
Manufacturing files
Import the files needed for manufacturing, Gerbers/ODB++, layout plan, Pick & Place file.
Label definition
Create your label online from a template, for all your traceability or marking needs.
Coating definition
Choose the right protection for your project from a selection of standard varnishes and resins.
X-ray images
Select the components for which you want to obtain an X-ray image.
Price Optimizer
It is a unique EMSFACTORY cost analysis tool based on lead time and quantities, taking into consideration the best offers from our suppliers.
Online order
Validate and pay your order online, edit a pdf quote, share your cart with your colleagues.
Track manufacturing and delivery
Stay informed about the progress of your order from your web account by receiving notifications.



  • 3,000,000 solder paste dots printed/h
  • 100,000 SMD components assembled/h
  • 5000 through-hole components/day
  • 1,000,000 components received/day
  • 100 m² of PCBs manufactured/day
  • 10 000 000 passive components in stock


  • 3 automated CMS lines
  • 1 line selective solder wave
  • 1 X-ray machine
  • 3 AOI 3D machines
  • 1 auto wash machine
  • 1 auto rework machine


Entrance control/preparation
All components are counted and repackaged for placement by an SMD Pick & Place machine.
Jetting solder paste deposit
New generation digital deposition technology: “jetting” prints the solder paste like an inkjet printer.
Automatic SMD placement
Our precision robots place your components from the smallest (01005) to the largest (70x70mm).
Reflow oven
The boards pass through the convection oven which respects a JEDEC temperature profile, and is checked daily by a profiler.
AOI inspection
The AOI machine takes HD photos of the board, and checks all SMD assembly acceptance criteria.
X-ray inspection
We carry out X-rays of the most complex assemblies to be controlled (BGA, LGA, etc.).
Press Fit
Connectors and components are force-fitted using a controlled pneumatic press and special tooling.
Insertion through hole component
The pins of the component are bent and cut then the components are inserted on the PCB.
Selective solder wave
Boards pass through the selective wave which solder through hole components using a molten alloy pot with a nozzle.
Visual inspection
The assembly of through-hole components is checked according to the criteria of IPC standards.
Tropicalisation (option)
We apply the varnish of your choice to your boards to protect them from all environmental aggressions.
Manufacturing and compliance report
A report is automatically generated and can be downloaded to your web account containing all the information related to the manufacturing process.
Packing and shipping
Your order is packed in an antistatic bag and sent by express carrier.

Electronic board assembly characteristics


5x5mm to 400x500mm
On request special stackup
ENIG (NiAu), HAL, Sn, Ag
1 to 48 layers
Controlled impedances
Rigid, SMI, Flex, Rigid-Flex
Green, white, black, red soldermask
Via filled, µVia laser, via blind/buried
FR4, CEM, Roger, Tg 180°C, IRC 600V


SMD, Through hole, PressFit, THR (Through hole reflow or Pin In Paste), Dipping
Reballing, reconditioning, baking of components
Screwing, gluing, crimping
Unit labeling
BGA, µBGA, LGA, FlipChip, QFN, 0201,…
Fine Pitch 0,3mm


High Definition and 3D AOI
Ion contamination measurement
X-ray inspection machine
Thickness measurement of deposited varnishes
X-ray image capture
T° and H° production monitoring
Electrical measurement of passive components

Our clients

Contact us